Apple Secures TSMC’s Complete 2nm Chip Production for iPhone 17

According to taiwanese news-outlets, Apple has clinched the entire 2nm chip allocation from Taiwan Semiconductor Manufacturing Company (TSMC) for its upcoming iPhone 17 series, putting Apple at the forefront of next-gen chip technology. Impact on Apple’s Future Devices The move mirrors Apple’s strategy used for previous iPhone and Mac models. The inclusion of 2nm chips will likely boost the upcoming iPhone’s performance and energy efficiency, with the iPhone 17 expected to roll out in 2025. This decision highlights Apple’s focus on maintaining a competitive edge in the smartphone market. Early Production Trials at Baoshan Plant TSMC, a front-runner in semiconductor manufacturing, unveiled its 2nm chips to Apple last December, highlighting improvements in performance and energy efficiency. These trial runs will be crucial for testing the feasibility of large-scale production. TSMC aims to achieve a stable yield rate to avoid the issues encountered with the 3nm chips, which had yield rates slightly over 50%. TSMC will reportedly kick off trial production of 2nm chips ahead of schedule at its Baoshan facility in Taiwan’s Shinju Science Complex. Initially slated for an October start, the timeline has been pushed forward to the third quarter to stabilize production and enhance yield rates before large-scale manufacturing begins. The semiconductor sector grapples with achieving consistent high yield rates, especially for advanced process nodes. TSMC’s early start on the 2nm trial is a proactive approach to address these issues and meet Apple’s demand. Successful trials are pivotal for ensuring TSMC can meet the production volume required for Apple’s future devices. Technological Advancements in 2nm Process In April, TSMC’s President confirmed the finalization of the 2nm processor design, featuring Nanosheet technology. The 2nm process will cater to similar applications as its 3nm predecessor, prominently in smartphones and high-performance computing (HPC). Equipment for 2nm production has been installed at the Baoshan plant since Q2, with trial production beginning in Q3, earlier than market expectations. Starting with the 2nm process, TSMC plans to incorporate gate-all-around (GAA) technology to enhance performance and power efficiency, along with backside power delivery (BPD) technology. In the first half of 2024, TSMC produced 99% of the world’s AI semiconductors. More AI and high-performance computing semiconductors are slated for mass production in the latter half of the year using TSMC’s current 3 and 5nm technologies. TSMC and China-Taiwan Tensions TSMC, which, besides to Apple, is a major supplier to other tech giants like Nvidia, has been exploring options to shift its production facilities from Taiwan abroad to mitigate risks of a Chinese invasion. The company concluded that such a move was impractical due to logistical challenges. Rising tensions between China and Taiwan have fueled these considerations. Beijing’s recent military maneuvers following the inauguration of Taiwanese President Lai Ching-te have intensified concerns about the stability of supply chains, particularly for companies reliant on TSMC’s semiconductor production.